My client is a global name in the semiconductor and packaging industry and now seek an experienced Packaging Program Development Manager
- World Leader
- Innovative Technology
- High Salary
Responsibilities:
- Develop and implement packaging design rules and other specifications for module assembly process
- Manage technical program in developing materials and assembly process by providing technical risk assessment
- Perform material related benchmarking & technology surveys
- Develop and implement laminate, flipchip bumping and assembly design rules
- Lead new product introduction of packages in different assembly factories, validate the materials, process parameters using DOE methodology, and establish necessary process controls and monitors
- Provide material related technical solution and guideline to the team
- Achieve the target assembly yields & quality requirement during development stage with DFM solution
- Qualify new products coordinating the required package level and board level reliability testing with the quality and reliability group and conduct failure analysis
Requirements
- Advanced degree in engineering or material science with at least 10-15 years of assembly experience using laminate substrate for CSP product or equivalent
- At least 5-7 years of mold process experience on laminate package through transfer/compression mold technology
- Experience in process development and improvement
- Prior knowledge in design and development of new packages
- Familiarity with flip chip process and semiconductor packaging technologies
- Qualify the designed package, materials and processes through reliability stress testing
- Stronghold with thermal and mechanical material properties of mold compound
- Experience in reliability/failure analysis will be an added advantage
- Experience in System in Package (SIP) module and general assembly processes
Please send your resume in WORD format by clicking the apply button below or contact Abhik Damani on +65 6701 1527 for a confidential discussion. Please note that only short-listed candidates will be contacted. CEI Reg. Number R1544061 (Abhik Damani).