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Principal Engineer, IC Packaging (Optics)

Principal Engineer, IC Packaging (Optics)

  • Location

    Singapore, Singapore

  • Sector:

    Engineering & Manufacturing

  • Job type:

    Permanent

  • Salary:

    S$6000 - S$9000 per month

  • Contact:

    Abhik Damani

  • Contact email:

    abhik.damani@voltasia.com.sg

  • Job ref:

    BBBH6572_1558680072

  • Published:

    3 months ago

  • Expiry date:

    2019-06-23

  • Consultant:

    #

My client is a world leader in optical components and laser products and now seek a highly experienced engineer for Optics IC Packaging

World Leader

Innovative Products

High Salary

Responsibilities:

  • Assume responsibility to develop photonics Integrated Circuit packaging design and process capabilities to meet technology and product roadmap
  • Develop Photonics Packaging products from design, prototyping, to process and product qualification
  • Develop Engineering and Manufacturing Specifications for packaging parts and processes
  • Design and develop essential packaging capabilities, including wafer-scale flip-chip assembly & precision dicing
  • Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time;
  • Contribute in planning and execution of essential improvement program
  • Provide documentation & regular technical reporting and coordinate with the NPI teams to fulfil the Technology and Product Development programs.
  • Serve as a technical team and act as a subject matter expert
  • Interface with supplier and internal staffs concerning quality ensure implementation of effective corrective action

Requirements:

  • Masters or PhD in Electrical Engineering, Physic, Optics, Photonics or equivalent with at least 18 - 10 years' experience with technical background in optoelectronics packaging or optomechanical assembly and test development
  • Prior work experience in new product and/or new process development and qualification
  • Hands-on experience with die-assembly tool, flip-chip bonder, wire bonder, and CAD drawing or equivalent
  • Electronic packaging knowledge with hands-on experience in die-bonder equipment will be an added advantage
  • Photonic packaging knowledge and semiconductor wafer packaging will be a big plus
  • Knowledge of production and automation equipment, processes, designs and functions
  • Excellent communication and negotiation skills
  • Proven organizational skills and multi-tasking skills
  • Passionate R&D mindset

Please send your resume in WORD format by clicking the apply button below or contact Abhik Damani on +65 6701 1527 for a confidential discussion. Please note that only short-listed candidates will be contacted. CEI Reg. Number R1544061 (Abhik Damani).